Dissolution at Interfaces in Layered Solid-Liquid Thin Films: A Key Step in Joining Process

F Baras and V Turlo and O Politano, JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 25, 3270-3274 (2016).

DOI: 10.1007/s11665-016-1989-4

We have studied the dissolution process of Ni into liquid Al in Ni-Al multilayer nanofilms by means of molecular dynamics simulations. The elemental mechanisms underlying the dissolution process were described and found to be diffusion-limited. The subsequent evolution leading to intermetallic compound formation was analyzed and interpreted on the basis of classical nucleation theory. A better understanding of the microscopic behavior of Ni-Al reactive multilayer foils, which was essential for their use in joining applications, was obtained.

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