Molecular dynamics study on nanometric cutting of ion implanted silicon

JS Wang and XD Zhang and FZ Fang, COMPUTATIONAL MATERIALS SCIENCE, 117, 240-250 (2016).

DOI: 10.1016/j.commatsci.2016.01.040

Single crystals are widely used in many high-tech areas. Since a high efficiency machining is difficult to be achieved due to their brittleness or hardness, the nanometric cutting of ion implanted material (NiIM) has been proposed to solve this problem successfully. In this paper, the mechanism of NiIM is studied using the molecular dynamics. The nanometric cutting on the monocrystalline and implanted silicon are investigated comparatively. The stress distribution is used to characterize the machinability. The results provide intuitive images to understand the mechanism of ion modification on nanometric cutting. It is indicated that the uniformity of a modified layer plays a critical role in improving the cutting performance. The results are of great value for the process parameters design in practice. (C) 2016 Elsevier B.V. All rights reserved.

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