Some Critical Issues in Pattern Collapse Prevention and Repair
XM Xu and N Vrancken and G Vereecke and S Suhard and G Pourtois and F Holsteyns, ULTRA CLEAN PROCESSING OF SEMICONDUCTOR SURFACES XIII, 255, 147-151 (2016).
In semiconductor fabrication, pattern collapse of high aspect ratio structures after wet processing is a major problem that could reduce production yield. In this work, several critical issues which limit our understanding of pattern collapse phenomenon are discussed together with some recent results of experiment and modeling. Special efforts have been put to update some of the most recent developments in characterization techniques.
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