A molecular dynamics study of tilt grain boundary resistance to slip and heat transfer in nanocrystalline silicon

X Chen and LM Xiong and A Chernatynskiy and YP Chen, JOURNAL OF APPLIED PHYSICS, 116, 244309 (2014).

DOI: 10.1063/1.4905248

We present a molecular dynamics study of grain boundary (GB) resistance to dislocation-mediated slip transfer and phonon-mediated heat transfer in nanocrystalline silicon bicrystal. Three most stable < 110 > tilt GBs in silicon are investigated. Under mechanical loading, the nucleation and growth of hexagonal-shaped shuffle dislocation loops are reproduced. The resistances of different GBs to slip transfer are quantified through their constitutive responses. Results show that the Sigma 3 coherent twin boundary (CTB) in silicon exhibits significantly higher resistance to dislocation motion than the Sigma 9 GB in glide symmetry and the Sigma 19 GB in mirror symmetry. The distinct GB strengths are explained by the atomistic details of the dislocation-GB interaction. Under thermal loading, based on a thermostat-induced heat pulse model, the resistances of the GBs to transient heat conduction in ballistic- diffusive regime are characterized. In contrast to the trend found in the dislocation-GB interaction in bicrystal models with different GBs, the resistances of the same three GBs to heat transfer are strikingly different. The strongest dislocation barrier Sigma 3 CTB is almost transparent to heat conduction, while the dislocation-permeable Sigma 9 and Sigma 19 GBs exhibit larger resistance to heat transfer. In addition, simulation results suggest that the GB thermal resistance not only depends on the GB energy but also on the detailed atomic structure along the GBs. (C) 2014 AIP Publishing LLC.

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