MD simulation of nanometric cutting of copper with and without water lubrication
YH Chen and H Han and FZ Fang and XT Hu, SCIENCE CHINA-TECHNOLOGICAL SCIENCES, 57, 1154-1159 (2014).
Three-dimensional molecular dynamics (MD) simulation was carried out to understand the mechanism of water lubrication in nanometric cutting. The water-lubricated cutting was compared with the dry cutting process in terms of lattice deformation, cutting force, heat and pressure distribution, and machined surface integrity. It was found that water molecules effectively reduce the friction between the tool and workpiece, the heat in the cutting zone and the pressure being generated on the tool surface, thus leading to prolonged tool life. Water molecules also enlarged the pressure-affected area, which decreased the roughness of the machined surface.
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