Atomistic modeling size dependence of nano-voided copper yielding under uniaxial tension
KJ Zhao and C Chen, ADVANCES IN HETEROGENEOUS MATERIAL MECHANICS 2008, 338-341 (2008).
Molecular dynamics (MD) simulations on cylindrical voided copper behaviors under uniaxial tension are performed, to study the size dependence of stress-strain response curve and dislocation emission from void free surface. The Embedded Atom Method (EAM) potentials developed by Foils et al. and Mishin are adopted. Atomistic calculation shows the larger matrix has the lower yield stress and the critical stress for dislocation emission decreases with increasing the void size. By employing common neighbor analysis method, it is found phase transformation inducing at the yielding point from the void free surface. This size dependence is expected to provide some helpful insights on understanding the damage mechanism at nano scale.
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