An Investigation of the Tensile Deformation and Failure of an Epoxy/Cu Interface Using Coarse-Grained Molecular Dynamics Simulations
SR Yang and JM Qu, 2014 15TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME) (2014).
In this study, a coarse-grained model is developed to describe the interatomic interactions between a cross-linked epoxy and a copper substrate, Based on this model, the tensile deformation and failure of an epoxy/Cu bimaterial is studied. Attention is given to the microstructural evolution near the epoxy/Cu interface, and its effects on the overall stress-strain behavior of the bimaterial. It is found that, under uniaxial strain, plastic deformation in the epoxy/Cu bimaterial is localized to a thin layer of epoxy next to the epoxy/Cu interface. This discovery enables the definition of an interfacial zone. Consequently, a macroscopic cohesive zone model can be constructed at the continuum level where the separation of the interface is given by the stretching of the interfacial zone in its thickness direction.
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