Molecular dynamics simulation of tensile behavior of diffusion bonded Ni/Al nanowires

ZJ Hu and JJ Zhang and YD Yan and JC Yan and T Sun, JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, 27, 43-46 (2013).

DOI: 10.1007/s12206-012-1231-8

Interfaces play key roles in determining mechanical properties of materials. In current work we perform molecular dynamics simulations of diffusion bonding to evaluate the effect of temperature on the morphology of the Ni/Al interface and the strength of the diffusion bonded Ni/Al nanowires. The centro-symmetry parameter is adopted to identify defect atoms generated. Simulation results show that the thickness of the Ni/Al interface has strong dependence on the temperature of diffusion bonding. Following uniaxial tension tests indicate that the yield strength of Ni/Al nanowires is smaller than both the single crystalline Ni and Al nanowires, because of the Ni/Al interface acting as dislocation source and the mobilization of pre- existing dislocations at high temperature. It is shown that the mechanical properties of diffusion bonded Ni/Al nanowires strongly depend on the temperature.

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