Highly efficient thermal glue for carbon nanotubes based on azide polymers
YX Ni and HL Khanh and Y Chalopin and JB Bai and P Lebarny and L Divay and S Volz, APPLIED PHYSICS LETTERS, 100, 193118 (2012).
Equilibrium molecular dynamics (EMD) simulations and experimental data show that the thermal contact resistance (TCR) between carbon nanotube (CNT) and azide-functionalized polymer with C-N bond is significantly decreased compared to that with Van der Waals force interaction. EMD simulations indicate that C-N covalent bond between CNT and polymer is the most efficient way to reduce TCR, and we measured the lowest thermal interface resistance of Si/CNT/Polymer/Cu thermal interface material as 1.40 mm(2) KW-1 with CNTs of 10 mu m length. These results provide useful information for future designs of thermal glue for carbon-based materials with better thermal conduction. (C) 2012 American Institute of Physics. http://dx.doi.org/10.1063/1.4711809
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