Fracture during high-velocity impact of copper plates: a molecular dynamics study
S Rawat and M Warrier and S Chaturvedi and VM Chavan, 23RD INTERNATIONAL CONFERENCE ON HIGH PRESSURE SCIENCE AND TECHNOLOGY (AIRAPT-23), 377, 012104 (2012).
High velocity impact of copper plates has been studied using the molecular dynamics code LAMMPS. The impact of copper plates at 1100 m/s impact velocity shows that spall of the material takes place at 160 kbar tensile pressure. Void nucleation is not observed at lower impact velocities where the peak tensile pressure stays below 160 kbar. No significant void nucleation occurs in the neighbouring regions where the peak tensile pressure stays below 160 kbar. For impact velocities close to the threshold, we observe stochastic behaviour of the spall process with respect to small changes in the initial atomic coordinates.
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