Molecular dynamics simulation study of cold spray process

A Joshi and S James, JOURNAL OF MANUFACTURING PROCESSES, 33, 136-143 (2018).

DOI: 10.1016/j.jmapro.2018.05.005

Cold Spray (CS) process is a deposition process in which micron-to-nano sized solid particles are deposited on a substrate using high-velocity impacts. Unlike thermal spray processes, CS process does not melt the particles thus retaining their original physical and chemical properties. These characteristics make CS process ideal for various engineering applications. The bonding mechanism involved in CS process is hugely complicated considering the dynamic nature of the process. Even though CS process offers great promises, the realization of its full potential is limited by lack of understanding of the complex mechanisms involved. The study focuses on understanding the complex nanoscale mechanisms involved in CS process. The study uses Molecular Dynamics (MD) simulation technique to understand the material deposition phenomenon during the CS process. For the simulation conditions used, the study finds that the quality of deposition is highest for an impact velocity of 700 m/s, the particle size of 20 angstrom and an impact angle of 90 degrees. The von Mises stress and plastic strain analysis revealed that bonding mechanism in CS process could be attributed to adiabatic softening, adiabatic shear instabilities followed by interfacial jetting of particle materials resulting in a uniform coating. The findings of this study can further the scope and applications of CS process.

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