Wettability of Ag nanocluster on Cu-Ni alloys: A computational approach
DH Chung and H Guk and SH Choi and D Kim, JOURNAL OF ALLOYS AND COMPOUNDS, 682, 844-849 (2016).
The conductive pastes containing Ag particles are used for patterning the electrodes of electronic devices such as solar cells and touch screen panels. Although Cu@Ag type metal particles have been tried as a substitute instead of Ag for cost reduction, the dewetting of Ag from Cu core during the processes has limited the use of Cu as a core metal. In this work, to investigate the Cu-Ni alloys as the core metal, we analyze the surface structures of Cu-Ni alloys and measure the compatibility between Ag and Cu-Ni alloys as wells as Cu and Ni by calculating the contact angles of Ag droplet on the metal surfaces using molecular dynamics simulations. As the Ni content of Cu-Ni alloys increases, the contact angle decreases: the contact angles for Cu, Cu3Ni, CuNi, CuNi3, and Ni are 69.6, 52.6, 50.5, 45.1, and 8.9 degrees, respectively. Therefore, the wettability of Ag on the Cu-Ni alloys is improved with the Ni content in the Cu-Ni alloys. This result indicates that the Cu-Ni alloys could be good candidates as the core metal to be used in the metal particles for the conductive pastes. (C) 2016 Elsevier B.V. All rights reserved.
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