Velocity and Thermal Slip at the Moving Contact Line
JJ Thalakkottor and K Mohseni, 2016 15TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM), 1139-1142 (2016).
The no-slip boundary condition is known to produce stress and velocity singularity at the moving contact line. Recent molecular dynamics simulations have shown that this is not the case, rather in the vicinity of the contact line velocity slip is observed, with the contact line undergoing perfect slip. It is known that velocity slip is often accompanied by thermal slip, resulting in a temperature jump at the interface. The degree of thermal slip is defined by Kapitza length which is analogous to slip length and is of the same order of magnitude as it. It has been recently shown that the standard Navier and Maxwell's velocity slip model is not sufficient to capture slip in the vicinity of moving contact line. Here we first present a universal velocity slip model and then explore using molecular dynamics simulations, the extent of thermal slip in the vicinity of the contact line and the impact it has on nano-/micro-fluidic applications.
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