Yield strength in nanocrystalline Cu during high strain rate deformation
Vo, NQ (Vo, Nhon Q.); Averback, RS (Averback, Robert S.); Bellon, P (Bellon, Pascal); Caro, A (Caro, Alfredo)
SCRIPTA MATERIALIA, 61 (1): 76-79 JUL 2009
Molecular dynamics simulations are used to study the yield strength of thermally annealed nanocrystalline Cu samples. For strain rates of 1 x 10(10) and 1 x 10(9) s(-1), the observed yield strength scales with the fractional number of grain boundary (GB) atoms. This observation suggests a new scaling behavior for the onset of plasticity in nanocrystalline materials, controlled not by the grain size alone, but by a combination of both grain size and degree of GB relaxation, as measured by the GB volume. (c) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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