Microstructure evolution and mechanical behavior of the Ni/Ni3Al interface under thermal-mechanical coupling
JG Yu and QX Zhang and ZF Yue and R Liu and MK Tang and XW Li, MATERIALS EXPRESS, 5, 343-350 (2015).
Molecular dynamics (MD) simulations are used to understand the microstructure evolution and mechanical behavior of the Ni/Ni3Al interface under thermal-mechanical coupling. The results indicate that the shapes of dislocation networks of the laminated model and the sandwich model are the symmetrical pi-shaped and the symmetrical double- deck pi-shaped respectively. We find that the rod dislocation only exists in the sandwich model. The critical shear stress of laminated model is larger than the sandwich model's. The stress and potential energy of dislocation network are larger than other places in the Ni/Ni3Al interface. Moreover, slip systems of the laminated model and the sandwich model are (1) over bar 11(101), 11 (1) over bar(011), 1 (1) over bar1((1) over bar 01) and 111(0 (1) over bar1).
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