Nanobending of nanowires: A molecular dynamics study
Yan, YD (Yan, Y. D.); Zhang, JJ (Zhang, J. J.); Sun, T (Sun, T.); Fei, WD (Fei, W. D.); Liang, YC (Liang, Y. C.); Dong, S (Dong, S.)
APPLIED PHYSICS LETTERS, 93 (24): Art. No. 241901 DEC 15 2008
Three-dimensional molecular dynamics simulations of the nanobending of copper nanowires are carried out. Simulation results show that the loading and unloading cycles of the nanobending test can reveal the full spectrum of the nanowires' mechanical properties. Up-tensile and bottom-compressive features have been observed along with the neck zone formation. Amorphous region formation is the mechanism of fracture and final breakage. The measured elastic modulus and yield stress are 49 and 7.6 GPa, respectively. Moreover, the effect of the adhesion on the nanobending process is revealed.
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