**Universal interfacial thermal resistance at high frequencies**

A Rajabpour and S Volz, PHYSICAL REVIEW B, 90, 195444 (2014).

DOI: 10.1103/PhysRevB.90.195444

The existence of a universal interfacial thermal resistance in a broad
range of systems is shown using linear response theory and computations
of realistic materials. When the thermal excitation is modulated up to
frequencies larger than the intrinsic resistance scattering rate defined
in a previous paper **A. Rajabpour and S. Volz, J. Appl. Phys. 108,
094324 (2010)**, the interfacial resistance becomes reversely
proportional to frequency and only depends on the number of degrees of
freedom involved in the heat transfer between both systems. We present
molecular dynamics simulations of connected crystals corroborating these
statements from both quantitative and qualitative viewpoints. This
finding significantly impacts the thermal management of nanoelectronic
systems at nanoscales where heat removal mainly relies on interfacial
scattering.

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