Molecular Dynamics Analysis of Metal Surface Sputtering due to Bombardment of High Energy Particles
KK Kumar and FS Donbosco and R Kumar, PROCEEDINGS OF THE 29TH INTERNATIONAL SYMPOSIUM ON RAREFIED GAS DYNAMICS, 1628, 916-924 (2014).
Dependence of sputtering yield of Cu (100) and Ni (100) metal surface by bombardment of 200 Ar ions at various energies and angles of projections is investigated in this paper. The sputtering yield has been calculated by performing molecular dynamics simulation and the same is compared with experiments and theoretical predictions wherever possible. Additionally the kinetic energy, velocity and scattering angle distribution for sputtered and incident atoms are also observed. The results obtained from the present molecular dynamics simulations are found to be in good agreement with experimental data and theoretical estimates. It is observed that the sputtering yield increases as the energy of the bombarding ion increases. Furthermore as the incidence angle increases, the sputtering yield increases until a specific angle and then decreases as normal incidence is approached.
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