The interplay between strain and size effects on the thermal conductance of grain boundaries in graphene
SJ Tang and Y Kulkarni, APPLIED PHYSICS LETTERS, 103, 213113 (2013).
The effect of strain on the thermal transport across grain boundaries in graphene is investigated using molecular dynamics simulations. The thermal boundary conductance is found to decrease significantly under biaxial tension as expected. In contrast, under biaxial compression, the thermal boundary conductance is strongly affected by the dimensions of the graphene monolayer, increasing with strain for specimen with length- to-width ratio of less than 20 and being insensitive to strain for length-to-width ratio above 20. This rather unexpected size-dependence under biaxial compression is found to be a result of geometric instabilities. (C) 2013 AIP Publishing LLC.
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