Negative correlation between in-plane bonding strength and cross-plane thermal conductivity in a model layered material
ZY Wei and YF Chen and C Dames, APPLIED PHYSICS LETTERS, 102, 011901 (2013).
The effects of in-plane (IP) and cross-plane (CP) interatomic bonding strengths on the IP and CP thermal conductivities of a model layered material are investigated using molecular dynamics and lattice dynamics. Increasing the IP bonding strength while holding the CP bonding constant increases the IP thermal conductivity, but reduces the CP thermal conductivity. Analogous but weaker trends are seen when increasing the CP bonding strength while holding the IP bonding constant. These results show how both low-and high-symmetry directions must be considered to understand the effects of phonon focusing on the thermal conductivity tensor of highly anisotropic materials. (C) 2013 American Institute of Physics. http://dx.doi.org/10.1063/1.4773372
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