Anisotropy of Wetting and Spreading in Binary Cu-Pb Metallic System: Experimental Facts and MD Modeling

V Timoshenko and V Bochenkov and V Traskine and P Protsenko, JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 21, 575-584 (2012).

DOI: 10.1007/s11665-012-0184-5

Contact angle for millimeter-size drops of lead on 100 and 110 surfaces of monocrystalline copper and on polycrystalline copper was determined by means of dispensed drop technique at 450 A degrees C under He-H-2 atmosphere. It was demonstrated that the wetting anisotropy (a difference between contact angles on differently oriented substrates) is not exceed a few degrees. Spreading kinetics was found to be different for the first and second drops deposited on each substrate. This result was interpreted as an effect of a lead precursor film formation on the substrate surface. Molecular dynamics simulations of the lead drop spreading over 111, 100, and 110 surfaces of monocrystalline copper confirm the weak anisotropy of equilibrium contact angle and a formation of lead precursor film on copper surface in front of wetting line.

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