Pressure free sintering of silver nanoparticles to silver substrate using weakly binding ligands
R Durairaj and R Ashayer and HR Kotadia and N Haria and C Lorenz and O Mokhtari and SH Mannan, 2012 12TH IEEE CONFERENCE ON NANOTECHNOLOGY (IEEE-NANO) (2012).
The use of a weakly binding ligand to facilitate sintering between particles and a planar substrate in the absence of pressure and at low homologous temperature has been explored. Ag nanoparticles in the 5-15 nm range suspended in water and stabilized by a BH4 complex were dropped onto a polished Ag substrate heated to 333 K. The Ag particles sintered to each other and to the substrate to form a largely pore free system. A molecular dynamics simulation is used to understand the theoretical limits of pressure free sintering and practical implications for adhesive systems based on Ag nanoparticle suspensions are discussed.
Return to Publications page