SHOCK LOADING AND RELEASE OF A SMALL ANGLE TILT GRAIN BOUNDARY IN CU
C Brandl and TC Germann, SHOCK COMPRESSION OF CONDENSED MATTER - 2011, PTS 1 AND 2, 1426 (2012).
Molecular dynamics simulations are performed to study the response of a dislocation tilt wall in Cu subjected to dynamic shock compression and release. We introduce a boundary condition for modeling the dynamics of a single interface subject to uniaxial loading parallel to the interface, avoiding artifacts from either periodic boundaries or free surfaces. The microstructure response for the small angle tilt boundary considered here is analyzed in terms of dislocation-dislocation interactions and the restoring forces which enable reversible dislocation motion upon release.
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