Melting of copper under high pressures by molecular dynamics simulation
YN Wu and LP Wang and YS Huang and DM Wang, CHEMICAL PHYSICS LETTERS, 515, 217-220 (2011).
By large scale molecular dynamics simulations of solid-liquid coexistence, we investigated the melting of copper under pressures from 0 to 400 GPa. The temperatures of liquid and solid regions, and the pressure of the system were calculated to estimate the melting point of copper. The melting curve of copper in our simulations is in general agreement with theoretical prediction of Moriarty. By the pair analysis technique, we found that the icosahedral short-range order in liquid copper increases gradually under compression, and dominates the local microstructure of the molten copper after about 130 GPa. (C) 2011 Elsevier B.V. All rights reserved.
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